Chinese storage company plans US$672m advanced packaging expansion
Shanghai-listed Biwin Storage Technology plans to invest 4.5 billion yuan, or about US$672 million, in the third phase of an advanced packaging and testing project in Dongguan. The move reflects a broader effort by Chinese storage makers to expand from module packaging into wafer-level operations.
Chinese storage manufacturers are seeking to move higher up the technology value chain, expanding beyond packaging chips into wafer-level operations, according to the supplied material. Shanghai-listed Biwin Storage Technology is the latest company cited in that shift. It plans to invest 4.5 billion yuan, equivalent to about US$672 million, in the third phase of an advanced packaging and testing project in Dongguan, in southern China’s Guangdong province.
The planned investment would be larger than the 3.09 billion yuan the company put into the first two phases of the project. The material does not provide a timetable for the new investment or details of its expected production capacity. Chinese storage makers have traditionally been known for packaging chips into modules.
The move into wafer-level operations suggests an effort to take on more technically advanced stages of production, although the supplied information does not describe the companies’ market shares or the likely commercial impact.
This independently written report is based on information supplied by the named publisher. Vertrix News has not independently verified the source report.